HIC Ltd - PCBs

Printed Circuits Boards

Automated SMT assembly

Automated printer

Samsung CP45FV Pick and Place machine

Board size: max 460x400 mm, min: 100x50 mm
Board thickness: max 4 mm, min 0.6 mm
Applicable components and packages: chips from 0201; ICs, connector 32x32mm, pitch 0.3mm; BGA 32x32mm
Mounting precision: chips ± 0.1mm; QFP ± 0.045mm; Connectors ± 0.05mm.
Mounting speed: Theoretical 18 900 cph
Can handle components from tapes, reels, sticks and trays.

Reflow oven HELLER 1707EXL

Force convection
Number of heating zones: 7 top and 7 bottom
Maximum temperature deviation on the PCB surface ± 2°C

SMT assembly line with TWS Quadra Pick and Place machines

§ Placement accuracy - 0.1 mm

§ Maximum size of PCB - 300 x 420 mm

§ Assembly of all kinds of surface-mount packages from 0402 to Fine-pitch components, as well as odd-form devices and some through-hole packages after leads treatment.

§ Components handled from tapes reels, sticks and trays

§ Microprocessor controlled temperature profile of reflow soldering.

§ Visual inspection before and after soldering; electric testing on request.

Assembly of through-hole components

Wave soldering:
- Maximum dimensions of PCB - 460x400 mm
- SMD components on solder side and on components side
- No clean water-soluble flux
Solder-iron assembly

Technological requirements

Preferred PCB finishing: hot-air solder level, Nickel/Gold
Components should be in original packaging appropriate for automated assembly (tapes, reels, sticks and trays )
Technological limits:
- Minimum spacing between SMT components - 0,5 mm
- Minimum spacing between a SMT components and a through-hole component - 1 mm
- Mounting pads dimensions - according to recommended by the company drawings.
- Mounting pads dimensions on the photomask for preparation of the solder stencil - identical to these of the mounting pads, special for fine. pitch components
- No through-holes in the mounting pads
- The pads of adjacent components should be separated by soldermask (even if they are electrically shorted)
Required data:
- BOM: nominal value, tolerance, type, package ( see example )
- Assembly diagram (including component reference and type/value, e.g. C21 - 680p, T8 - BC807)
- Photomask for solder stencil preparation - positive image on the emulsion side
- Pick&Place files preferred
We are ready to answer all your questions

complete electric diagram;
comprehensive parts list: value, type, tolerance and package of the passive components; type and package of the active components;
maximum dimensions or outline drawing if odd-shape is required;
any other specific requirements.